Yamaichi Electronics USA Will Participate in OIF PLL Interoperability Demo at The OFC 2019 in San Diego
San Jose, CA March 2017 – Yamaichi Electronics USA will participate in OIF (Optical Internetworking Forum) PLL Interoperability demo at the OFC 2018 exhibition, which will take place in San Diego, California on March 13th to 15th, 2018. As a longtime member of the OIF, Yamaichi will team up with other OIF members to demonstrate significant progress in delivering an interoperable ecosystem of suppliers and solutions for the critical market needs. Yamaichi will participate in 2 of the demonstrations, the 112 Gbps/lane Live Electrical Signaling and End to End (host to host) Optical Link Using 56G-VSR, including the newly released CEI 4.0.
The 112 Gbps electrical demo will include a silicon chip driving a VSR (chip to module) channel with OSFP connector and the second will have a silicon chip driving a LR (copper cable or backplane) channel with QSFP-DD connector. The demo will feature Yamaichi’s latest release of QSFP-DD module form factor. The QSFP-DD was selected for the demo because of the superior signal integrity performance. It is designed for the future generation of 112Gbps electrical signal link. The module form factor supports 8 channels of high speed signal and provide 800G throughput per module. Yamaichi offers various port layouts (1x1, 2x1, etc…), customized heatsinks and MCB/HCB as part of the connector solution.
Yamaichi has recently released OSFP module form factor. The OSFP supports 56~64Gbaud signals with 8 channels high speed electrical lanes that can support 400~800GbE technology and 64G ACO. As a complete solution, Yamaichi offers 1x1~1x4 port design with custom heatsinks and stacked type design to save space on PCB footprint. It is designed for future capability to meet the projected thermal requirements for 800 Gbps optics.
The 56Gbps demo will electrically drive interoperating optical modules, interconnected with fiber, showing a full multi-vendor electrical-optical-electrical link from host-to-host. This demo will feature Yamaichi’s QSFP HCB testing board.
Several years ago, Yamaichi launched the QSFP56 connectors. The market has recognized the QSFP56 for its superior signal performance. It has the same level of signal integrity performance as QSFP-DD and OSFP connectors. Back then, the technology was clearly ahead of its time. The QSFP56 connector supports 25/50/100/200 GbE Interface & Infiniband EDR/FDR/QDR/HDR. Yamaichi offers various port layout (1x1, 2x1, etc…), customized heatsinks and MCB/HCB as a complete connector solution that’s backward compatible with previous generation.
OIF Delivers on Another Industry First!
OIF member companies have teamed up to demonstrate significant progress in delivering an interoperable ecosystem of suppliers and solutions for critical market needs:
• FlexE (Flex Ethernet)
• 112 Gbps / lane live electrical signaling
• End to End (host to host) optical link using electrical 56 Gbps - VSR, included in newly released CEI 4.0
Public demonstrations will be on display March 5-7, 2019 at OFC in San Diego, CA in OIF Booth # 5525. Additional information can be found at www.oiforum.com/meetings-and-events/oif-ofc-2018
ABOUT Yamaichi Electronics USA:
Yamaichi Electronics USA, Inc. (YEU) is a wholly owned subsidiary division of Yamaichi Electronics Company, LTD. (YEC). This sub-division, referred to as “YEU”, serves as a Corporate Sales Office representing Yamaichi products in North America. Yamaichi’s parent corporation, YEC, has subsidiaries and manufacturing in over 11 different countries. YEU was founded and incorporated as a business on November 1, 1983, when it opened its first office in Palo Alto, California. Steady growth of the Yamaichi product lines in the United States include our Test & Burn-In sockets and Production connectors as well as standard and high-density connectors. In addition to our Headquarters in San Jose, California, YEU has a number of sale offices and representatives at key locations throughout the United States.