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Yamaichi Electronics Exhibits Next Generation High Speed Interconnect at DesignCon Jan 29th - 31 2019

 designcon 2019

DesignCon is happening January 29 – 31, 2018 at the Santa Clara Convention Center.

Yamaichi is a leading supplier of high speed connector and cable assembly products. We have achieved world class status as a manufacturer of quality interconnect products for pluggable module form factor on data networking market such as CFP, CFP2, CFP4, QSFP28/56 and SFP28/56 . Yamaichi collaborates with industry leaders to develop future 200, 400 and 800 Gb interconnect technologies.  In 2018, Yamaichi expands 64Gbps/ch signaling technologies into the next generation coherent optics and the dual density module form factors, includes CFP2-64, CFP4-64, CFP8, SFP/QSFP-DD, OSFP and On-board optics.

About DesignCon
DesignCon is the premier conference for chip, board and systems design engineers in the high speed communications and semiconductor communities—happening Jan. 31- Feb. 1, 2018 at the Santa Clara Convention Center. Through technical paper sessions, tutorials, industry panels, product demos and exhibits, attendees will gather the latest theories, methodologies, techniques and advanced design tools related to all aspects of electronic design. #DesignCon

WHEN: January 29 - 31, 2018

WHERE: Santa Clara Convention Center, California

Booth Location: #1049