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Yamaichi Electronics Exhibits Next Generation High Speed Interconnect at DesignCon Jan 30th - 31st 2019

 designcon 2019

DesignCon is happening January 30th – 31st, 2019

at the Santa Clara Convention Center.


Yamaichi is a leading supplier of high-speed connector and cable assembly products. We have achieved world class status as a manufacturer of quality interconnect products for pluggable module form factor on data networking market such as CFP, CFP2, CFP4, QSFP28/56 and SFP28/56.


Yamaichi collaborates with industry leaders to develop future 200, 400 and 800 Gb interconnect technologies.  In 2018, Yamaichi expanded 64Gbps/ch signaling technologies into the next generation coherent optics and the dual density module form factors, includes CFP2-64, CFP4-64, CFP8, SFP/QSFP-DD, OSFP and On-board optics.



DesignCon is the premier conference for chip, board and systems design engineers in the high speed communications and semiconductor communities. From January 30 - 31, 2019 at the Santa Clara Convention Center, the conference will be jam packed with technical paper sessions, tutorials, industry panels, product demos and exhibits.


2019 will be the 24th DesignCon and Yamaichi Electronics USA (YEU) is excited to exhibit at this grand event. We are back with our biggest booth yet: 10ft X 30ft. Some key products and demonstrations will take center stage: the stacked QSFP-DD connector & accessories, the QSFP-DD with high-speed jumper cable solutions, the DSFP connector and accessories, the pluggable 400G coherent optics connector (CFP2, CFP8,OSFP, QSFP-DD) and other high speed products.


Visit Us:


Visit us in booth #1034 on January 30 - 31, 2019 at the Santa Clara Convention Center (California) to see how Yamaichi’s products are helping various companies create better connection in High Speed applications.